Rapid PCB Prototyping

If you are introducing a new product, PCB prototyping is the easiest and cost-effective way of detecting and fixing errors. It enables the reduction of the risk of costly rework during mass production.

We offer quick prototype-making service and reverse engineering of existing assemblies.

Free DFM&DFA Check For Your PCB Prototyping-Best Technology
Free DFM & DFA Check

Best technology will provide free PCB file checks to make sure there are no missing components or incorrect construction, and check that these file designs are within the capabilities of our production process.

Cost Optimization

Are your prototype designs fully optimized?Our team of manufacturing experts will provide recommendations to cost reduction for you.

Consistency

Our prototypes are built under the same ISO-9001-2015 and IPC quality standards as production jobs. We can maintain that consistency over large volumes.

PCB Reverse Engineering

We also offer reverse engineering of existing assemblies.

 We can take an existing board from a bare board, an assembled board, existing drawings, and we can create a new design with all supporting documentation.

PCB Reverse Engineering Check Your PCB-Best Technology

PCB Prototype Capability

Follows are basic PCB production capability, but we are not limited by that

Item Capabilities
Layer Count
1 - 32 Layers
Max Board Dimension
24*24" (610*610mm)
Min Board Thickness
0.15mm
Max Board Thickness
6.0mm - 8.0mm
Copper Thickness
Outer Layer:1oz~30oz, Inner Layer:0.5oz~30oz
Min Line Width/Line Space
Normal: 4/4mil (0.10mm); HDI: 3/3mil (0.076mm)
Min Hole Diameter
Normal: 8mil (0.20mm) ; HDI: 4mil (0.10mm)
Min Punch Hole Dia
0.1" (2.5mm)
Min Hole Spacing
12 mil (0.3mm)
Min PAD Ring(Single)
3mil (0.075mm)
PTH Wall Thickness
Normal: 0.59mil (15um); HDI: 0.48mil (12um)
Min Solder PAD Dia
Normal: 14mil (0.35mm); HDI: 10mil(0.25mm)
Min Soldermask Bridge
Normal: 8mil (0.2mm); HDI: 6mil (0.15mm)
Min BAG PAD Margin
5mil (0.125mm)
PTH/NPTH Dia Tolerance
PTH: ± 3mil (0.075mm) ; NPTH: ±2 mil (0.05mm)
Hole Position Deviation
±2 mil (0.05mm)
Outline Tolerance
CNC: ± 6mil (0.15mm); Die Punch: ± 4mil (0.1mm); Precision Die: ± 2mil (0.05mm)
Impedance Controlled
Value>50ohm: ±10%; Value≤50ohm: ±5 ohm
Max Aspect Ratio
8:1
Surface Treatment
ENIG, Flash Gold, Hard Gold Finger, Gold Plating(50mil), Gold finger,

Selected Gold plating,ENEPIG, ENIPIG; HAL, HASL(LF), OSP, Silver Imm., Tin Imm
Soldermask Color
Green/White/Black/Yellow/Blue/Red
Item Capabilities
Layer Count
1 - 10 Layers
Max Board Dimension
24*64"(610*1625mm)
Min Board Thickness
0.6mm
Max Board Thickness
4.0mm
Conductor Thickness
0.5oz - 10oz
Min Line Width/Line Space
4/4mil (0.10/0.10mm)
Min Hole Diameter
10mil (0.25mm)
Min Punch Hole Dia
0.12" (3.0mm)
Min Hole Spacing
16mil (0.4mm)
Min PAD Ring(Single)
3mil (0.075mm)
PTH Wall Thickness
Normal: 0.59mil (15um); HDI: 0.48mil (12um)
Min Solder PAD Dia
14mil (0.35mm)
Min Soldermask Bridge
8mil (0.20mm)
Min BAG PAD Margin
5mil (0.125mm)
PTH/NPTH Dia Tolerance
PTH: ±3 mil (0.075mm); NPTH: ±2mil (0.05mm)
Hole Position Deviation
±3mil (0.075mm)
Outline Tolerance
CNC: ±6 mil (0.15mm); Die Punch: ±6 mil (0.1mm)
Max Aspect Ratio
10:1
Surface Treatment
ENIG, Flash Gold, Hard Gold Finger, Gold Plating(50mil), Gold finger,

Selected Gold Plating, ENEPIG, ENIPIG, HAL, HASL(LF), OSP, Silver Imm., Tin Imm
Item Thick Film Capabilities DCB/DBC Capabilities DPC Capabilities AMB Capabilities
Layer Count
10 Layers
2 Layers
2 Layers
2 Layers
Max Board Dimension
138*190mm
138*178mm
138*190mm
114*114mm
Min Board Thickness
0.25mm
0.30mm - 0.40mm
0.25mm
0.25mm
Max Board Thickness
2.0mm
1L: 1.3mm; 2L 1.6mm
2.0mm
1.8mm
Conductor Thickness
5um - 13um
0.10mm - 0.30mm
2um - 200um
0.25mm - 0.80mm
Min Line Width/Line Space
6/8mil (0.15/0.20mm)
12/12mil (0.30/0.30mm)
6/8mil (0.15/0.20mm)
20/20mil (0.50/0.50mm)
Substrate Type
Al2O3, AIN, BeO, ZrO2
Al2O3, AIN, ZrO2
Al2O3, AIN, ZrO2, Si3N4
Al2O3, AIN, Si3N4
Substrate Thickness
0.25, 0.38, 0.50, 0.635, 0.80,

1.0, 1.5, 2.0mm
0.25, 0.38, 0.50, 0.635, 0.76,

1.0, 1.5, 2.0mm
0.25, 0.38, 0.50, 0.635, 0.80,

1.0, 1.5, 2.0mm
0.25, 0.38, 0.50, 0.635, 0.76,

1.0mm
Min Hole Diameter
4mil (0.1mm)
Min Hole Spacing
NPTH: 16mil (0.30mm); PTH: 20mil (0.5mm)
Min PAD Ring(Single)
6mil (0.15mm)
N/A
3mil (0.075mm)
N/A
PTH Wall Thickness
4mil (10um)
N/A
4mil (10um)
N/A
Min Solder PAD Dia
10mil (0.25mm)
8mil (0.20mm)
6mil (0.15mm)
8mil (0.20mm)
Min Soldermask Bridge
12mil (0.30mm)
8mil (0.20mm)
6mil (0.15mm)
8mil (0.20mm)
Min BGA PAD Margin
12mil (0.30mm)
8mil (0.20mm)
5mil (0.125mm)
8mil (0.20mm)
PTH/NPTH Dia Tolerance
PTH: ±4mil (0.1mm) ; NPTH: ±2mil (0.05mm)
Hole Position Deviation
± 4mil (0.1mm)
Outline Tolerance
Laser: +0.20/-0.05mm
Line Width/Spac Tolerance
± 5mil (0.125mm)
± 5mil (0.125mm)
± 1mil (0.025mm)
± 5mil (0.125mm)
Surface Treatment
AgPd, AgPt, Au
OSP/Ni Plating/ENIG/ENEPIG
Thermal Stress
1 hour @ 350℃
3 x 10 Sec @ 280 ℃
15 min @ 350 ℃
3 x 10 Sec @ 280 ℃
Item Capabilities
Layer Count
1 - 30 Layers
Max Board Dimension
1L:500*2000mm; 2L:250*1380mm
Min Board Thickness
0.05mm
Max Board Thickness
3.0mm
Conductor Thickness
1/3 OZ(12 um) - 4OZ(140um)
Min Line Width/Line Space
2/2mil (0.05/0.05mm)
Min Hole Diameter
4mil (0.10mm)
Min Hole Spacing
NPTH:16mil (0.4mm); PTH:20mil(0.5mm)
Min PAD Ring(Single)
3mil (0.075mm)
PTH Wall Thickness
0.59mil (15um)
Min Solder PAD Dia
10mil (0.25mm)
Min Soldermask Bridge
12mil (0.30mm)
Min BAG PAD Margin
12mil (0.30mm)
PTH/NPTH Dia Tolerance
PTH: ±3mil (0.075mm); NPTH: ±2mil (0.05mm)
Hole Position Deviation
±4mil (0.10mm)
Outline Tolerance
Laser: +0.15mm / -0.05mm; Die Punch: +0.10 / -0.20 mm
Max Aspect Ratio
8:1
Surface Treatment
ENIG, Flash Gold, Hard Gold Finger, Gold Plating(50mil), Gold Finger, Selected Gold Plating, ENEPIG, ENIPIG
Impedance Controlled
Value>50ohm: ±10%; Value≤50ohm: ±5 ohm
Item Capabilities
Layer Count
2 - 50 Layers
Max Board Dimension
500*500mm
Min Board Thickness
0.30mm
Max Board Thickness
4.0mm
Conductor Thickness
0.5oz(18 um) - 2oz(70um)
Min Line Width/Line Space
3/3mil (0.075/0.075mm)
Min Hole Diameter
4mil (0.10mm)
Min Hole Spacing
NPTH:16mil (0.4mm); PTH:20mil(0.5mm)
Min PAD Ring(Single)
3mil (0.075mm)
PTH Wall Thickness
0.59mil (15um)
Min Solder PAD Dia
10mil (0.25mm)
Min Soldermask Bridge
12mil (0.30mm)
Min BAG PAD Margin
12mil (0.30mm)
PTH/NPTH Dia Tolerance
PTH: ±3mil (0.075mm); NPTH: ±2mil (0.05mm)
Hole Position Deviation
±4mil (0.10mm)
Outline Tolerance
Laser: +0.15mm / -0.05mm; Die Punch: +0.10 / -0.20 mm
Max Aspect Ratio
8:1
Surface Treatment
ENIG, Flash Gold, Hard Gold Finger, Gold Plating(50mil), Gold Finger, Selected Gold Plating, ENEPIG, ENIPIG
Impedance Controlled
Value>50ohm: ±10%; Value≤50ohm: ±5 ohm

F.A.Q.

  • PCB Project: Price reply with in 12 hours
  • PCBA Project:Price reply with in 24-48 hours

Best Technology promises not to disclose any design/manufacture files about your project. We can sign NDA with you to ensure the safety of your project.We respect the privacy of all our customers. We promise we will never share your personal information with any third parties.Learn more for our privacy policy.

If you are placing a fully consigned assembly order, please provide:

  • Gerber files
  • BOM (.xls, .xlsx)
  • Pick & place file (.xls, .xlsx, .txt, csv)
  • Fabrication and assembly drawings
  • Readme.txt file

Prove your design with our rapid PCB prototyping

Our team will reach out to you as soon as we can to discuss how our services can meet your needs.

    Optional,max 10MB.

    *We respect your confidentiality and all information are protected.